Vertiv CoolLoop™

Innovative Heat Rejection System for Hybrid Cooling in AI and High-Density Applications

The Vertiv CoolLoop™ is a state-of-the-art, flexible heat rejection system designed to optimize cooling efficiency in hybrid liquid and air cooling systems. Engineered to support the growing demands of AI applications, high-density data centers, and advanced computing environments, Vertiv CoolLoop™ offers a scalable and reliable solution for modern thermal management.

Key Benefits

  • ​AI & Densification-ready with an efficiency increase of nearly 70%.
  • Up to 2.6 MW of cooling capacity, reaching 3 MW in the air-cooled configurations.
  • Compact design with a net gain of over 40% cooling capacity.
  • Liquid cooling-ready supporting both air- and hybrid- cooled configurations.
  • Free cooling optimization minimizing power consumption to handle operational peaks.
  • Compliant with major current and future bans and EU F-Gas regulations for years to come.
  • R1234ze inverter driven technology to maximize efficiency.
  • Global solution, suitable for data centers in various climates around the world.

Key Features:

  • Up to 40°C supply water temperature.​
  • Up to almost 3 MW** of cooling capacity in a single, compact frame.
  • Easy coupling with Vertiv™ CoolChip CDU and Vertiv™ CoolCenter Immersion systems.​
  • Very low-GWP R1234ze refrigerant (GWP = 7 as per IPCC AR4).
  • Free cooling coils optimized for high ambient temperatures incorporating microchannel heat exchangers for superior heat transfer.
  • Inverter-driven technology.
  • Active harmonic filters in the electrical panel.
  • Wide range of external temperatures from -20°C to over 52°C.

Applications:

  • AI-Driven Applications: Vertiv CoolLoop is ideal for cooling the powerful hardware used in AI and machine learning, where heat dissipation is critical to performance.
  • High-Density Data Centers: Perfect for supporting high-density racks and workloads in modern data centers that require efficient thermal management.
  • HPC Environments: Optimized for high-performance computing, where cooling demands can be intense and complex.
  • Hybrid Cooling Environments: Ideal for data centers implementing a hybrid liquid and air cooling approach to meet diverse thermal management needs.

 

A Smarter Way to Keep Your Data Center Cool

Vertiv CoolLoop’s advanced, flexible, and scalable design allows businesses to efficiently manage heat in high-density environments. With its ability to integrate seamlessly into hybrid cooling systems and optimize performance for AI and high-performance computing applications, Vertiv CoolLoop™ is the future of data center thermal management.