MegaMod CoolChip offers advanced direct-to-chip liquid cooling solutions that meet the rigorous demands of high-performance compute servers. As the demand for generative Artificial Intelligence, Machine Learning, and High-Performance Computing escalates, data centers are entering a new era of infrastructure innovation. The emergence of high-compute CPUs and GPUs in data center racks is transforming traditional cooling strategies, paving the way for liquid cooling technologies.

Three Distinct MegaMod CoolChip Designs

MegaMod CoolChip provides three unique designs to support direct-to-chip liquid cooling, each catering to different aspects of air-cooled architecture:

  • Flexible Perimeter Cooling: Offers adaptability and efficient space utilization.
  • Room Neutral In-Row Cooling: Provides precise cooling within data center rows.
  • Space-Saving Rear-Door Heat Exchangers: Maximizes cooling efficiency while conserving space.

Introducing MegaMod CoolChip Solutions

Vertiv innovative MegaMod CoolChip technology offers comprehensive data center infrastructure solutions designed for the burgeoning high-density market. These solutions are versatile—available as stand-alone units, adaptable within existing facilities, or as fully equipped, prefabricated, scalable, modular systems ready for deployment. By integrating pre-engineered and prefabricated components, you can achieve rapid deployment, reducing installation time and mitigating risks associated with quality and scheduling.

Key Features and Components

  • MegaMod Cooling Distribution Unit (CDU): Manages secondary fluid networks, ensuring contaminant-free design for optimal water quality and separation of primary facility water from ITE heat loads.
  • MegaMod Split Indoor Chiller: Features integrated pumped refrigerant economization for efficient cooling.
  • Air Cooling Units: High-performance solutions with perimeter, in-row, and rear-door heat exchanger options.
  • Liquid-Cooled Racks: Secure critical devices and enable high-density applications.
  • Reliable Power Distribution: Advanced rack power distribution units (rPDUs) ensure reliable power supply.
  • Integrated Secondary Fluid Network and Manifolds: Provide seamless connectivity between cold plates and cooling units.

Why Liquid Cooling?

Liquid cooling is significantly more effective than air cooling, ensuring critical equipment remains within optimal temperature ranges and enabling the seamless performance of AI and high-compute applications. Rather than replacing traditional air cooling, liquid cooling complements it, efficiently managing the heat load from high-density racks. This hybrid approach signifies a revolutionary shift in data center cooling methodologies.

Accelerating AI-Ready Data Centers

With AI demand outpacing supply, data center operators are focused on quickly bringing new capacity online. MegaMod CoolChip designed to meet this challenge, offering a prefabricated modular data center solution equipped with liquid cooling for efficient and reliable AI computing. Configurable to support leading AI compute platforms, these solutions reduce deployment time by up to 50%.

Designed for High-Density Compute

MegaMod CoolChip supports high-density IT systems with customer-selected AI compute providers, integrating accelerated computing platforms into equipment racks with advanced plumbing and high-density rPDUs. Direct-to-chip cooling ensures efficient heat management, optimizing efficiency for AI compute platforms.

Sustainability

MegaMod CoolChip solutions can retrofit existing facilities or serve as new, freestanding data centers. With a focus on sustainability, these solutions improve Power Usage Effectiveness (PUE), reducing the carbon footprint compared to traditional technologies.

Comprehensive Management

From consultation to lifecycle services, MegaMod CoolChip streamlines processes, offering cost and schedule efficiencies with single-source accountability. By leveraging factory-controlled assembly and testing, Vertiv ensures quality, control costs, and accelerate project timelines.

Vertiv and Alexander Schneider provide advanced solutions developed in collaboration with leading companies in the artificial intelligence industry, enabling the operation and cooling of ultra-high energy density computing systems. For detailed information on HVAC, power, and communication solutions for AI applications, please contact Info@schneider.co.il or your Alexander Schneider representative.