Engineering the AI Factory: Navigating Power, Cooling, and Scalability in the Age of Accelerated Computing

Introduction: 

The explosive growth of artificial intelligence is driving an unprecedented demand for high-performance computing infrastructure. AI Factories, purpose-built data centers designed to handle massive AI workloads, are emerging as a critical necessity. This post explores the key engineering challenges in designing and building these advanced facilities, focusing on power delivery, cooling, and scalability. 

 

 Challenges: 

  • High-Density Power Demands:  AI workloads, particularly those leveraging advanced GPUs, necessitate unprecedented power delivery and power densities. A single GPU rack can demand significant power, requiring robust power shelves and high-capacity Bus Bar feeds.  GPU racks today consume over 130KW per rack and soon we will see GPU racks consuming 500KW and above per rack. This translates to substantial power delivery requirements, with high amperage 3-phase feeds and robust bus bar systems (e.g., 800A-1200A bars) becoming standard. 
  • Power Distribution and Redundancy:  AI Factories demand highly reliable power distribution architectures to ensure continuous operation. In addition, redundancy is paramount in some cases, with configurations designed to maximize uptime.  
  • Dynamic Power Loads and Energy Storage:  AI workloads exhibit highly dynamic power consumption patterns. This requires AI-Ready UPS systems with fast transient response capabilities. Large battery arrays, including Lithium or Nickel-Zinc based technologies, are needed to support the high power consumption and fluctuations, while VRLA chemistries are no longer relevant.
  • Transition to Liquid Cooling:  Air cooling alone is insufficient to manage the heat generated by high-density AI hardware. Therefore, Liquid cooling is becoming a necessity, with a shift towards hybrid approaches. Engineers must select appropriate liquid cooling topologies, such as direct-to-chip, rear-door heat exchangers, or Fan Walls just to mention a few.
  • Scalability and Deployment:  AI Factories must be designed for rapid scaling  = by utilizing modular designs, using prefabricated components and standardized interfaces, accelerate deployment.  Liquid Cooling temperatures to the GPU may also vary in time between 20C-40C to the chip and the designers must design in flexibility to avoid frequent retrofits.  
  • High-Speed Networking:  High-speed networking, including 800G fiber and high-density cable management, is essential for AI workloads 

 

How to optimize the new AI factories?  

One way is to use an integrated design for power and cooling. This means that the power and cooling systems are designed together to work more efficiently. 

Another way to optimize AI factories is to use high-efficiency components. This includes using high-efficiency servers, storage, and networking equipment. It also includes using high-efficiency power and cooling systems. By using high-efficiency components, AI factories can reduce their energy consumption and operating costs. 

 Another way to optimize AI factories is to use real-time monitoring and control. This allows operators to track the performance of the AI factory and make adjustments as needed. For example, operators can use real-time monitoring to identify and fix problems with the cooling system. By using real-time monitoring and control, AI factories can improve their uptime and performance. 

Accelerating Time to Market with Modular Solutions 

Deploying AI factories quickly is a major competitive advantage. Modular and pre-engineered solutions significantly reduce deployment time by leveraging factory-built components that can be rapidly deployed and commissioned on-site. Solutions like Vertiv MegaMod offer a ready-to-go infrastructure that cuts installation time by up to 50% compared to traditional data centers. The Vertiv PowerNexus is another example of a pre-engineered integrated UPS and LV switchgear solution that cuts time and cost.

  

Key Benefits of Modular AI Data Centers: 

  • Rapid Deployment – Pre-engineered, factory-built modules allow faster and smoother implementation by up to 50%, reducing delays. 
  • Cost Predictability – Standardized configurations ensure a known cost structure with minimal risk of budget overruns. 
  • Scalability & Flexibility – Modular solutions allow AI infrastructure to expand seamlessly as computing demands grow. 
  • Reduced On-Site Complexity – Pre-tested, plug-and-play systems simplify installation and minimize construction-related disruptions as well as reduces the number of on-site skilled labor during installation, startup and commissioning . 

To meet the increasing power and cooling demands of AI workloads, organizations are turning to integrated, scalable solutions that optimize efficiency and performance. Companies provide advanced solutions such as: 

  • PowerNexus Skid – A modular power unit offering up to 2.5MW of integrated power, including UPS, switchgear, and monitoring tools for rapid deployment. 
  • Hydro Skids & Cooling Modules – Pre-engineered cooling systems designed to work in sync with liquid-cooled AI hardware, improving energy efficiency and heat management. 

The Future of AI Factories – Smart, Modular, and Scalable 

To keep pace with AI-driven demands, data centers must be adaptable and ready for expansion. Solutions like Vertiv MegaMod and Power Skids allow for rapid setup, cost efficiency, and seamless scalability without traditional design constraints 

Conclusion: 

Engineering AI Factories demand a holistic approach, integrating advanced power delivery, liquid cooling, and scalable infrastructure. By addressing these challenges and leveraging expertise in critical infrastructure solutions, engineers can build the foundation for the AI-driven future. The increasing demands of AI workloads will continue to push the boundaries of data center design, requiring ongoing innovation and adaptation.